Jacob H. Prosser, Teresa Brugarolas, Steven Lee, Adam J. Nolte, and Daeyeon Lee
One way to use engineered nanoparticles in the real world is in thin films. Nanoparticle thin films have a wide range of applications in drug delivery, nanoelectronics, magnetic storage devices, sensors, or optical coating. One major complication to making nanoparticle films arises from cracks that develop during the fabrication of the films. When a film is made from a suspension of nanoparticles, cracks form if the film thickness exceeds a critical value. Lee and his team have now described a simple method for fabricating thick, crack-free silica nanoparticle films by subsequent deposition of thin, crack-free silica nanoparticle multilayers. The nanoparticles in the film are believes to covalently bond to one another – even though they are at room temperature – after the deposition of each crack-free layer, giving them the strength to resist crack formation during subsequent layer depositions. This method does not require any added chemicals nor does it require new substrates or new deposition technique/equipment. Thus, this new technique is practical and can be used by anyone who is interested in making thick crack-free nanoparticle films. One of the most important applications of this crack-free film fabrication will be in the area of energy conversion and storage because many energy devices are made of nanoparticle films. The method developed by Lee’s team could potentially be used to generate thick crack-free films – even on thermally labile surfaces to make flexible devices – that will optimize the properties of various energy devices.
[ Nano Letters Article ] Nano Lett. September 19, 2012 [ Nanowerk Spotlight Article ] Nano Lett. September 26, 2012 [ Press Release ] Penn News October 11, 2012